发明名称 Transfer module and cluster system for semiconductor manufacturing process
摘要 A number of process chambers connected to a transfer module can be increased after a cluster system provided with the transfer module is initially established. The transfer module transfers an object to be processed between a transfer chamber and at least one process chamber connected to the transfer chamber. A housing of the transfer module defines the transfer chamber, the housing having a substantially rectangular cross section so that a plurality of the housings are connectable to each other. A movable part is provided in the transfer chamber, the movable part being movable along a base surface provided in the housing of the transfer module. A transfer part is provided on the movable part, the transfer part holding the object to be processed and being movable between the transfer chamber and the process chamber. A drive mechanism drives the movable part, and a control unit controls motion of the movable part.
申请公布号 US6634845(B1) 申请公布日期 2003.10.21
申请号 US20000595930 申请日期 2000.06.16
申请人 TOKYO ELECTRON LIMITED 发明人 KOMINO MITSUAKI
分类号 H01L21/68;B65G49/06;B65G49/07;H01L21/00;H01L21/677;(IPC1-7):B65G49/05 主分类号 H01L21/68
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