发明名称 Method of manufacturing a semiconductor device having signal line above main ground or main VDD line
摘要 A semiconductor device is disclosed, by which the parasitic capacitance of each signal line can be decreased, the time necessary for developing the device can be decreased, and which has a structure for simply and quickly performing the characteristic evaluation of the semiconductor device. The semiconductor device comprises a lower-layer signal line provided below one of a main power-supply line and a main ground line via an insulating layer; and an upper-layer signal line provided above said one of the main power-supply line and the main ground line via an insulating layer. A window is formed in said one of the main power-supply line and the main ground line; and the lower-layer signal line and the upper-layer signal line are electrically connected in a space inside the window, without contacting said one of the main power-supply line and the main ground line.
申请公布号 US6635515(B2) 申请公布日期 2003.10.21
申请号 US20020120976 申请日期 2002.04.11
申请人 NEC CORPORATION 发明人 OKUAKI KATSUMI
分类号 H01L21/768;H01L21/8242;H01L23/48;H01L23/522;H01L23/528;H01L27/10;H01L27/108;(IPC1-7):H01L21/82 主分类号 H01L21/768
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