| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a three-dimensional laminated module which is properly structured so as to protect an electronic component against damage when it is built in the module. <P>SOLUTION: Sheet-like resin insulating materials (60) are laminated into a laminate, and an electronic component (12) is buried in the laminate for the formation of the three-dimensional laminated module. The module is characterized by the fact that one surface (12h) of the electronic component (12) which comes into contact with the mounting surface (60a) of the resin insulating materials (60) is flattened. Therefore, a fragile part (represented by codes A to D in Figure 7 (c)) produced in a conventional technique is hardly produced, therefore even though a pressure is applied to the electronic component for pressing when the laminate formed of the resin insulating materials (60) is molded, the electronic component is hardly damaged, so that the three- dimensional laminated module having a proper structure capable of protecting the electronic component against damage when built in it and the electronic component used for the same can be provided. <P>COPYRIGHT: (C)2004,JPO</p> |
