| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a double-side circuit board, by which a thin circuit board and high density mounting thereon can be preferably realized. SOLUTION: Preparing an insulation base 2 having conductive layers 1, 3 on its both surfaces, through-holes 5 penetrating from its one conductor layer 1 to another conductor layer 3 are arranged in the insulation base 2. The through-holes 5 are filled with a conductive paste or a conductive ink to form conductor sections 6, and after grooves 7 needed for forming required wiring patterns are formed in the conductor layer 1, grooves 8 are formed utilizing the grooves 7 in the insulation base 2 by laser beam machining, plasma etching or wet etching. Wiring patterns 9 are formed by filling in the grooves 8 with the conductive paste or the conductive ink, and the remaining conductor layer 1 is removed. In the conductor layer 3, required wiring patterns are formed by a conventional method, or the required wiring patterns are filled and formed by applying above method. COPYRIGHT: (C)2004,JPO
|
