| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a contact sheet capable of sure mutual electrical connection by coping with dimensional dispersion caused by each of an integrated circuit and a board, excellent in durability and reliability against repeated use, and suitably used for a high-frequency test and packaging between the integrated circuit and the board. <P>SOLUTION: This contact sheet 10 is provided with: a substrate sheet 1 with a plurality of opening cut-out parts 11 formed; and contacts 2 each having one tip part 21 interposed and fixed between two substrate sheets 1a and 1b at one edge 12 of the cut-out part 12, and the other tip part 23 arranged so as to bend as a cantilever when a load is applied to the tip part 23. The contact sheet is characterized by that each contact 2 has a bending part 22 nearly at its longitudinal center part, and the width (W) thereof in a direction perpendicular to the longitudinal direction continuously varies to be set greater at its parts subjected to larger stresses and less at its parts subjected to smaller stresses when a load is applied to the tip part 23. <P>COPYRIGHT: (C)2004,JPO</p> |
