METHOD FOR MANUFACTURING CERAMIC CHIP PACKAGE

摘要

PURPOSE: A method for manufacturing a ceramic chip package is provided to be capable of improving the reliability and endurance of the ceramic chip package by coating epoxy resin containing fine ceramic grains for protecting a plurality of chips mounted on a ceramic substrate. CONSTITUTION: A ceramic substrate(21) mounted with a plurality of chips(23a,23b,23c,23d) by each package unit, is prepared. An epoxy resin layer(24) is selectively formed at the upper portion of the ceramic substrate for covering the chips. Then, a hardening process is carried out at the epoxy resin layer. A dicing process is carried out at the ceramic substrate by the package unit. Preferably, the epoxy resin layer contains SiO2. Preferably, the epoxy resin layer is uniformly formed in order to secure a flat upper surface.