| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor chip press-fixing device for preventing the position deviation and warpage of a substrate by surely fixing and disposing the substrate to a support table of the semiconductor chip press-fixing device, in the semiconductor chip press-fixing device for press-fixing a semiconductor chip to the substrate in a thin film shape. <P>SOLUTION: The semiconductor chip press-fixing device for mounting the semiconductor chip on the substrate mounted on the support table and press- fixing the semiconductor chip to the substrate by pressurizing it with a pressurizing body is provided with a substrate holding body for pressurizing and fixing the substrate where the semiconductor chip is mounted on the support table linked with the pressurizing operation of the semiconductor chip by the pressurizing body. Also, the substrate holding body is formed into a cylindrical shape surrounding the semiconductor chip. Also, the pressurizing body and the substrate holding body are linked and connected via an elastic body. Further, the pressurizing body is constituted capable of being heated. <P>COPYRIGHT: (C)2004,JPO</p> |
