| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem occurring when a chip part is mounted by using soldering and conductive paste in an IC package using a lead frame. <P>SOLUTION: In a semiconductor device obtained by mounting an IC chip to the die pad 2a of the lead frame and connecting the IC chip 1 to the inner lead 2b of the lead frame with a metallic wire 3, the chip part 4 is connected to the inner lead 2b through a metallic bump 9 formed at the inner lead 2b. <P>COPYRIGHT: (C)2004,JPO |
