ELECTRONIC COMPONENT MOUNTING DEVICE, ELECTRONIC COMPONENT MOUNTING METHOD, HOLDING DEVICE AND HOLDING METHOD

摘要

PROBLEM TO BE SOLVED: To mount an IC chip on a substrate without contaminating a plasma- treated substrate and the IC chip. SOLUTION: Inside a chamber 3 of a plasma treatment device 1, an inverting mechanism 33 for holding the IC chip by electrostatic attraction and vertically inverting it, a mounting mechanism 34 for receiving the IC chip from the inverting mechanism 33 by the electrostatic attraction, and a stage for the substrate holding the substrate by the electrostatic attraction are arranged. The stage for the substrate is connected to a high-frequency power source, and a plasma treatment is performed to the IC chip held by the holding part 34a for mounting the mounting mechanism 34 and the substrate. When the plasma treatment is performed, the chamber 3 is turned to a prescribed reduced pressure atmosphere by a pressure reducing mechanism 361 and a gas supply part 362. Thus, the IC chip is mounted without having to carry the substrate from the chamber 3 after the plasma treatment. COPYRIGHT: (C)2004,JPO