| 摘要 |
PROBLEM TO BE SOLVED: To provide a phenolic resin sealing plate for an electrolytic capacitor, which enhances its adhesive properties to an aluminum terminal by improving the weak point or low adhesive properties of a conventional phenolic resin for the electrolytic capacitor so as to enable the electrolytic capacitor to obtain superior airtight properties, without specially treating the terminal or modifying its shape. SOLUTION: A phenolic resin molding material containing a phenolic resin, an inorganic base material, and polyethylene having a number-average molecular weight of 500 to 8,000 and a metal terminal are formed into the sealing plate for the electrolytic capacitor by molding. It is preferable that the phenolic resin molding material contains 30 to 50 wt.% phenolic resin, 45 to 65 wt.% inorganic base material, and 0.1 to 5 wt.% polyethylene having a number- average molecular weight of 500 to 8,000. COPYRIGHT: (C)2004,JPO
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