| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board which is prevented from the increase of contact resistance, in the printed wiring board in which interlayer connections are obtained by embedding wiring patterns in a base and compressing a conductive paste, and to provide a manufacturing method thereof. SOLUTION: Since wiring patterns 6, 9 formed on support boards 2, 7 and metal layers formed thereon, for example, electrolytic nickel plating layers 5, 8 are embedded in a base, a conduction paste 14 filled in through-holes 13 arranged in prescribed positions of the porous base is fully compressed, and the densification of the conductive material in the conduction paste 14 is enhanced. Hence the printed circuit board having low connection resistance and reliable interlayer connections can be provided. COPYRIGHT: (C)2004,JPO |
