| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component which is suitable for forming external electrodes on two opposite side faces of a rectangular parallelopiped chip. SOLUTION: A chip holding plate 10 has 24 chip holding recesses 11b in total, each capable of storing and holding the rectangular parallelopiped chip CC having a dimensional relation of length > width > thickness in such a direction as to make salient one of two side faces defining the width of the chip CC. Using the chip holding plate 10, electrode paste CP is applied on one of the two side faces defining the width of the chip CC, with the chip CC held in each chip holding recess 11b of the chip holding plate 10, and then the applied paste CPa is dried. After conducting these operations, the chip CC held in each chip holding recess 11b of the chip holding plate 10 is transferred to each chip holding recess 11b of another chip holding plate 10. With the chip CC held in such a state, the electrode paste CP is applied on the other of the two side faces defining the width of the chip CC, and then the applied paste CPa is dried. COPYRIGHT: (C)2004,JPO
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