| 摘要 |
PROBLEM TO BE SOLVED: To mount a bare chip on the substrate of a counterpart without bringing adjoining bumps into contact with a lead wire passing between them with relatively gentle alignment accuracy at the time of face-mounting the bumps of the bare chip on the lead wires that are formed at fine pitches of 40μm or smaller on the mounted face side in a staggered arrangement. SOLUTION: In face-mounting a bare chip 10 on lead wires 21, the bump arrangement of the bare chip 10 is a staggered arrangement in which first and second rows are relatively offset by half a pitch. With the width W of each bump 11 and the distance L between the adjoining bumps 11 and 11, the relation between the width W and the distance L in each row is L-W=6 to 20μm. COPYRIGHT: (C)2004,JPO
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