| 摘要 |
The method comprises the steps of preparing the wafers of a substrate, the steps of transforming the wafers of the substrate allowing to define the micro-electro-mechanical structures within the same substrate, and the later steps of processing the wafers or the fractions of wafers of the substrate including the micro-electro-mechanical structures. At the start of the steps of transforming the wafers or the fractions of wafers of the substrate, and also eventual supplementary elements susceptible to come in contact with the wafers or the fractions of wafers of the substrate, are placed on support organs; and the support organs are placed in containers for transport and storage ensuring a protection with respect to particulate contamination and electrostatic discharges. The containers for transport and storage are of type closed case. The storage containers are of type Front Opening Universal Pod (FOUP), which can ensure the transport of the wafers of the substrate of 300 mm, and also of type Standard Mechanical InterFace (SMIF) cases for the wafers of size 150-200 mm. The dimensions of the support organs are analogous to those of the wafers of the substrate which can be stored in the containers for transport and storage. The substrate is for example of semiconductor material, glass, quartz, or other material. |
