| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve the effectiveness of a mounting body of an electronic component. <P>SOLUTION: After providing conductive adhesive material layers 7c and 7d each composed of a thermoplastic resin or a thermosetting resin in a liquid shape on the external connection part 2 of the electronic component 1 and the mounting connection part 5 of a mounting member 4 where the electronic component 1 is mounted, the electronic component 1 is positioned and loaded on the mounting member 4 so as to make both conductive adhesive material layers 7c and 7d face each other. Thus, even when a failure occurs after a conductive adhesive material is set, the electronic component 1 and the mounting member 4 are separated by dissolving the thermoplastic resin by an organic solvent and is subjected to repair. Also, the thermoplastic resin does not cause bulk destruction with respect to stress and a structure stable with respect to thermal stress which extends over a long period of time is attained. <P>COPYRIGHT: (C)2004,JPO</p> |
