MULTILAYER WIRING BOARD, ITS MANUFACTURING METHOD, AND WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring board, which is capable of easily providing a region that is locally high in wiring density to each wiring layer of the multilayer wiring board. SOLUTION: Wiring (conductor pattern) is provided in layers on an insulating board for the formation of the multilayer wiring board as an insulator layer is interposed between wiring layers. A first wiring board where one or more wiring layers are provided is provided on the first insulating board, and a second wiring board where a wiring layer is provided is provided on the first wiring board for the formation of the multilayer wiring board. The second wiring board is laminated and bonded on the first wiring board, and the wiring of the first wiring board is electrically connected to that of the second wiring board for the formation of the multilayer wiring board. COPYRIGHT: (C)2004,JPO