发明名称 CERAMIC SUBSTRATE FOR MULTIPLE-CHIP RESISTOR
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a ceramic substrate for multiple-chip resistor, that is provided with longitudinal and transverse dividing grooves and through-holes which are formed at regular intervals on either the longitudinal or the transverse dividing grooves, is divided into a product section partitioned by the outermost longitudinal and transverse dividing grooves and a dummy section between the outermost longitudinal and transverse dividing grooves and the outer periphery of the substrate, and is reduced in the occurrence of defective products by stabilizing the dimensions the and shapes of the outermost through-holes. <P>SOLUTION: In the dummy section 6a including parts of the through-holes 5a formed on the outermost dividing grooves 2a, a plurality of dummy through- holes 7 is formed at intervals equal to those of the through-holes 5a formed on the dividing grooves 2a. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2003297616(A) 申请公布日期 2003.10.17
申请号 JP20020092547 申请日期 2002.03.28
申请人 KYOCERA CORP 发明人 HIRANO OSUKE
分类号 H01C17/06;H01C7/00;(IPC1-7):H01C17/06 主分类号 H01C17/06
代理机构 代理人
主权项
地址