| 摘要 |
PROBLEM TO BE SOLVED: To provide megasonic cleaning equipment employed in the manufacturing of a semiconductor element where contaminant particles can be removed efficiently from the surface of a wafer while preventing pattern lifting. SOLUTION: The megasonic cleaning equipment comprises a piezoelectric converter 110 generating megasonic energy, and an energy transmitting means 120 fixed in the radial direction with respect to a wafer, and stirring cleaning liquid on the wafer 130 by transmitting energy generated from the piezoelectric converter 110 thereto. The energy transmitting means 120 is designed such that the flow of stirred cleaning liquid imparts energy uniformly to the wafer 130 in the radial direction, thus removing contaminant particles. Since energy does not concentrate at some parts on the wafer 130 even if the magnitude of energy is increased sufficiently for attaining a desired cleaning effect, the contaminant particles can be removed efficiently from the surface of the wafer 130 while preventing pattern lifting. COPYRIGHT: (C)2004,JPO
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