| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for semiconductor package and a semiconductor package exhibiting excellent wiring density, and methods for producing a substrate for semiconductor package and a semiconductor package exhibiting high connection reliability at a low cost while simplifying the process. SOLUTION: The substrate for semiconductor package comprises internal connection terminals for connection with a semiconductor chip, external connection terminals, wiring conductors for connecting the internal and external connection terminals, and an insulating resin layer for supporting the wiring conductors wherein the upper surface of the wiring conductor and the uppermost surface of the insulating resin layer has the same height. A semiconductor package comprising the substrate for semiconductor package and a semiconductor chip for connection with the internal connection terminals is also provided. COPYRIGHT: (C)2004,JPO
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