摘要 |
<p>There is disclosed a fabrication method comprising: stacking and forming an Ni bond layer <bold>3 </highlight>and oxidation preventive layer <bold>4 </highlight>on a Cu interconnection layer <bold>2 </highlight>formed on the surface of a BGA package <bold>1 </highlight>in an electroless plating process; and applying a flux <bold>5 </highlight>to coat the oxidation preventive layer <bold>4. </highlight>Moreover, the method comprises: laying a Cu-added solder ball bump <bold>6 </highlight>onto the oxidation preventive layer <bold>4; </highlight>and performing a heat treatment in a temperature range of 190° C. to 220° C. to melt/bond the bump into the Ni bond layer <bold>3. </highlight>Sn and Cu in the Cu-added solder ball bump <bold>6 </highlight>rapidly react with Ni in the Ni bond layer <bold>3 </highlight>to form a diffusion inhibitive alloy layer <bold>7. </highlight>Subsequently, an electrode pad <bold>10 </highlight>on a mother board <bold>9 </highlight>which is a interconnection substrate is molten/bonded into the Cu-added solder ball bump <bold>6, </highlight>and a semiconductor device <bold>8 </highlight>is mounted on a mother board <bold>9. </highlight></p> |