| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wireless communication apparatus with a high radiation efficiency and ease of manufacture at a low manufacturing cost and having a wide application scope. <P>SOLUTION: A radiation conductive layer 22 is provided to a one-side surface of a dielectric board 21 in the thickness direction, an earth conductive layer 23 is provided to an other-side surface of the dielectric board 21 in the thickness direction, a tag IC 24 is provided to the dielectric board 21 and the radiation conductive layer 22 or the earth conductive layer 23, and the tag IC 24 is electrically connected to the radiation conductive layer 22 and the earth conductive layer 23. The dielectric board 21 is configured such that a main dielectric part 25 with an excellent high frequency characteristic, that is, a low dielectric loss is placed at the dielectric board 21 at an area clamped by a radio wave radiation face 22a and an earth face 23a and its vicinity area and an inexpensive auxiliary dielectric part 26 made of a type of material different from that of the main dielectric part 25 is placed around the main dielectric part 25. <P>COPYRIGHT: (C)2004,JPO |
