ELECTRONIC DEVICE AND ITS MANUFACTURING METHOD, AND WIRING BOARD AND SEALING MEMBER USED FOR MANUFACTURE OF ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To suppress a rise in pressure in a cavity part by expansion of steam in the cavity part in an electronic device wherein the cavity is provided.

SOLUTION: The electronic device comprises a wiring board where wiring (a conductor pattern) is provided on the surface of an insulating board, a chip- like element provided on the wiring substrate a conductive member connecting and estimal terminal of the chip element with a wiring of the wiring boad, and a sealing member which seals the periphery of the chip-like element. The electronic device has the cavity between the wiring substrate and the chip-like element. The sealing member comprises a steam transmitting member which transmits the steam and a cap member which does not transmit or hardly transmits the steam. The steam transmitting member communicates the inside of the cavity and the outside of the sealing member.

COPYRIGHT: (C)2004,JPO