发明名称 HIGH FREQUENCY MODULE
摘要 PROBLEM TO BE SOLVED: To shift the resonance frequency higher than a practical frequency band to a resonance structure region. SOLUTION: The high frequency module 1 has a coplanar integrated circuit 3 comprising an insulating substrate 4, a coplanar transmission line 5 consisting of a main signal line 8 formed on the insulating substrate 4 and a pair of ground conductors 9 and 9 provided on the opposite sides of the main signal line 8, and a circuit element 6 provided on the main signal line 8. The coplanar integrated circuit 3 is connected with the insulating substrate 4 and mounted on a conductive base 2. A dielectric 22 is provided in a resonance structure region 23 between the ground conductor 9 and the conductive base 2. The resonance structure region 23B provided with the dielectric 22 has a dielectric constant lower than that of the resonance structure region 23A not provided with the dielectric 22. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003297972(A) 申请公布日期 2003.10.17
申请号 JP20020096584 申请日期 2002.03.29
申请人 ANRITSU CORP 发明人 SENDA HIROAKI;OZAWA KAZUYA
分类号 H01L23/12;(IPC1-7):H01L23/12 主分类号 H01L23/12
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