| 摘要 |
PROBLEM TO BE SOLVED: To provide a die bonding collect having a small amount of relative dislocation between a component and the die bonding collect at the time of picking up a minute component such as a semiconductor element to convey it and a small amount of dislocation at the time of fixing the minute component to a substrate. SOLUTION: A die bonding collect 1 has such a structure that two surfaces, the first and second abutting surfaces 4a and 4b that are orthogonal to each other, are arranged on an end face 2 at which a minute component is sucked. In the vicinity of the orthogonal part, a suction opening 3 is opened, and grooves 5a and 5b extending from the suction opening 3 are formed along the inside of the first and second abutting surfaces 4a and 4b. If the first and second abutting surfaces 4a and 4b are drawn near the minute component for vacuum suction, the minute component is sucked toward the two orthogonal abutting surface sides to contact the abutting surfaces 4a and 4b. Then, alignment is performed in a self-aligning way. COPYRIGHT: (C)2004,JPO |
