发明名称 |
SEMICONDUCTOR DEVICE HAVING METAL-INSULATOR-METAL TYPE CAPACITOR AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a metal-insulator-metal type capacitor and a method for manufacturing the same. <P>SOLUTION: The semiconductor device is provided with: a lower wiring formed on a semiconductor substrate; an intermetallic insulating film formed on the semiconductor substrate having the lower wiring; a plurality of openings formed through the intermetallic insulating film for exposure of the lower wiring; a lower electrode, which is formed in a conformal pattern, on the inner side walls of the openings, the surface portions of the exposed lower wiring and the intermetallic insulating film portions between the openings; a dielectric film and an upper electrode stacked in this order on the lower electrode; and an upper wiring arranged on the upper electrode. <P>COPYRIGHT: (C)2004,JPO</p> |
申请公布号 |
JP2003297942(A) |
申请公布日期 |
2003.10.17 |
申请号 |
JP20030063878 |
申请日期 |
2003.03.10 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
JIN YOU-SEUNG;AHN JONG-HYON |
分类号 |
H01L21/8242;H01L21/02;H01L21/768;H01L21/822;H01L23/522;H01L27/04;H01L27/08;H01L27/108;(IPC1-7):H01L21/822 |
主分类号 |
H01L21/8242 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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