| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component, and its producing method, in which both reduction in size and formation of a fine surface electrode are satisfied. SOLUTION: A through hole is made through an insulator substrate 1 and filled with firing type silver paste which is then fired at 800°C or above thus forming a through hole 2. A conductive protective film 3a and a back electrode 4 are then formed, respectively, on one and the other major surfaces of the insulator substrate 1 to cover the end face of the through hole 2. Subsequently, a fine surface electrode 7a is formed by lift-off method to cover the conductive protective film 3a. A low through hole conduction resistance is attained and a fine surface electrode can be formed. COPYRIGHT: (C)2004,JPO
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