| 摘要 |
PROBLEM TO BE SOLVED: To produce a circuit board having a circuit pattern formed with especially high accuracy at least on one side by controlling deformation of a flexible film susceptible to dimensional variation due to heat, humidity or an external force. SOLUTION: In the method for producing a circuit board by pasting a reinforcing plate to one side of a flexible film through a UV-curing organic matter layer, forming a circuit pattern on the other side of the flexible film and then stripping the flexible film having the circuit pattern from the reinforcing plate, the UV-curing organic matter layer is irradiated with UV-rays prior to a step for forming the circuit pattern. COPYRIGHT: (C)2004,JPO
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