| 摘要 |
PROBLEM TO BE SOLVED: To provide a constitution and a manufacturing method for further effectively manufacturing a device to be formed by combination of a number of heterogeneous devices. SOLUTION: The method for integrating a plurality of heterogeneous circuit devices 140, 150, 160, 170 in a single substrate 120 comprises the steps of: forming a first protection layer on the substrate 120; removing a part of the first protection layer; forming a high voltage well of a first circuit device on the substrate by ion implantation by using the partially removed first protection layer; forming a second protection layer on the substrate; removing a part of the second protection layer; and forming a first low voltage well 144 of a second circuit device on the substrate by ion implantation by using the partially removed second protection layer. COPYRIGHT: (C)2004,JPO
|
