发明名称 LIQUID TREATMENT DEVICE AND LIQUID TREATMENT METHOD
摘要 PROBLEM TO BE SOLVED: To provide a liquid treatment device in which liquid treatment can be carried out while controlling the temperature of treatment liquid, especially preventing the temperature drop of treatment liquid. SOLUTION: A cleaning unit (CLN) 12 provided in a system 1 for cleaning a semiconductor wafer W by supplying chemicals and the like thereto comprises a spin chuck 46 for holding the wafer W, and a nozzle 51a for supplying chemicals and the like to the wafer W wherein a chemical nozzle 51a comprises a pipe 52 for passing heated chemicals and the like supplied from a chemical supply system 70, and an outer tube member 53 surrounding the pipe 52. The outer tube member 53 has a double tube structure internally passing temperature-conditioned water in order to prevent the lowering of the temperature of chemicals flowing through the pipe 52. Consequently, the chemical supply system 70 supplies chemicals having conditioned temperatures to the wafer W. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003297788(A) 申请公布日期 2003.10.17
申请号 JP20020096384 申请日期 2002.03.29
申请人 TOKYO ELECTRON LTD 发明人 ORII TAKEHIKO;MUKOYAMA MASAHIRO;NANBA HIROMITSU;AMAI MASARU
分类号 B08B3/02;B08B3/10;H01L21/304;(IPC1-7):H01L21/304 主分类号 B08B3/02
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