| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve reliability. <P>SOLUTION: This semiconductor device comprises: a semiconductor chip 2; a sealing part 3 for sealing the semiconductor chip 2 with resin; a tab 1 whose rear surface 1a on a side opposite to a chip joining surface 1c to be joined with the semiconductor chip 2 is exposed to the surface 3b of the sealing part 3; a plurality of inner leads 1g electrically connected with pads for bonding the semiconductor chip 2 respectively through wires such as gold wires; and a plurality of outer leads 1h connected integrally with respective inner leads 1g and projecting to the outside of the sealing part 3. The entire surface of each of the tab 1b, a plurality of the inner leads 1g, and outer leads 1h is coated with palladium plating 6. Thus, when a heat radiation member is fitted to the rear surface 1a of the tab 1, the palladium plating 6 is not dissolved, so that coming out of the heat radiation member is prevented and reliability of QFP 1 is improved. <P>COPYRIGHT: (C)2004,JPO |
