| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for producing an electronic component in which a reliability can be enhanced without complicating the production process thereof. <P>SOLUTION: After a chip is mounted on an interposer (step S10) and then sealed (step S11), solder balls are mounted on the back of the interposer (step S12). Subsequently, sealing resin is applied to cover the solder balls and brought into stage B (step S14). After the surface of the sealing resin in stage B is partially removed and the solder balls are exposed (step S15), discrete electronic components are formed (step S16). Finally, the solder balls and the sealing resin in stage B are heated thus bonding the electronic components to a board (step S17). <P>COPYRIGHT: (C)2004,JPO</p> |
