METHOD OF MANUFACTURING SUBSTRATE FOR FLEXIBLE PRINTED WIRING BOARD AND SUBSTRATE FOR FLEXIBLE PRINTED WIRING BOARD OBTAINED THEREBY

摘要

PROBLEM TO BE SOLVED: To provide a method by which a substrate for flexible printed wiring board that is excellent in slidability and bendability at high temperatures and has a high adhesive strength even when the substrate is manufactured by bonding copper foil to a polyimide film at low temperatures can be manufactured. SOLUTION: In this method, the substrate for flexible printed wiring board is manufactured by laminating and integrating the copper foil upon and with the plasma-treated surface of the polyimide film through an adhesive layer after one surface of the polyimide film is plasma-treated. The polyimide film is heat-treated before the plasma treatment. COPYRIGHT: (C)2004,JPO