MASK FOR MANUFACTURING BUMP AND METHOD FOR MANUFACTURING BUMP OF SEMICONDUCTOR DEVICE USING THE SAME

摘要

PURPOSE: A mask for manufacturing a bump and a method for manufacturing the bump of a semiconductor device using the same are provided to be capable of simplifying bump manufacturing processes and reducing fabrication cost. CONSTITUTION: After forming a metal pad(11) on a semiconductor substrate(10), a passivation layer(12) is formed at the upper portion of the resultant structure for partially exposing the metal pad. A barrier metal(13) is formed at the resultant structure by carrying out Au deposition. A bump mask(20) is formed at the upper portion of the resultant structure, wherein the bump mask includes a plurality of via holes corresponding to each metal pad. A bump(14) is formed in each via hole by carrying out Au electroplating.