METHOD OF MANUFACTURING REFORMED INORGANIC FILLER

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a reformed inorganic filler suitable for the filler of an epoxy resin molding material for sealing a semiconductor. SOLUTION: In this method of manufacturing a reformed inorganic filler, a shearing force is imparted to the inorganic filler with an average particle diameter D50of 0.5μm or below at the rate of change of the average particle diameter in a range of 10% or lower under the presence of a coupling agent by using equipment having a mechanism having at least two rotors and capable of applying pressure to a raw material that is charged into a closed treatment chamber from at least one direction to impart the shearing force by rotations of the rotors. COPYRIGHT: (C)2004,JPO