发明名称 PIEZOELECTRIC THIN FILM ELEMENT AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a piezoelectric thin film element for high frequency band using a material that propagates waves at a high speed with little losses in its piezoelectric thin film. <P>SOLUTION: The piezoelectric thin film element having the piezoelectric thin film of about 1 &mu;m or less in thickness includes a substrate having front and rear surfaces, a supporting film provided on the front surface of the substrate and composed of a silicon oxide, etc., and a lower electrode provided on the supporting film and containing iridium, etc., as the main component. The thin film element also includes the piezoelectric thin film provided on the lower electrode and containing a material expressed by the chemical formula: ABOX as the main component, an upper electrode provided on the piezoelectric thin film and containing aluminum, etc., as the main component, and a recessed section formed by removing part of the substrate from the rear surface side until the rear surface of the supporting film below the piezoelectric thin film is exposed. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2003298131(A) 申请公布日期 2003.10.17
申请号 JP20020098484 申请日期 2002.04.01
申请人 MITSUBISHI ELECTRIC CORP 发明人 YAMADA AKIRA;MAEDA CHISAKO;NOZAKI AYUMI;MIYASHITA SHOJI
分类号 C23C14/34;H01L41/08;H01L41/09;H01L41/18;H01L41/22;H01L41/316 主分类号 C23C14/34
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