| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a dielectric film for printed wiring board exhibiting excellent heat resistance, moisture resistance, insulation, adhesion, workability, machinability, and the like, and having a low elasticity high elongation stress relaxing function. <P>SOLUTION: The dielectric film for printed wiring board principally comprises drawn porous polytetrafluoroethylene impregnated with resin having adhesion or bondability and exhibits modulus of elasticity of 0.1-1.8 GPa and tensile stretch at break (at 25°C) of at least 4.0% after curing. The semiconductor device comprises a multilayer printed board having a plurality of circuit layers, and a semiconductor element mounted on the multilayer printed board wherein an insulating adhesive layer having a stress relaxing function is provided between the outermost circuit layer of the multilayer board on the semiconductor element side and an adjacent circuit layer, and the insulating adhesive layer is formed of the dielectric film. A printed wiring board is also provided. <P>COPYRIGHT: (C)2004,JPO</p> |
