| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor-manufacturing apparatus and a semiconductor device that can uniformly apply specific liquid to a wafer in a manufacturing process of a semiconductor. <P>SOLUTION: A level 103 is provided at the side of a chuck 102 for supporting the wafer 1. The level 103 detects a horizontal retention state in the wafer 1 supported by the chuck 102. <P>COPYRIGHT: (C)2004,JPO</p> |
