RESIN COMPOSITION FOR LIGHT EMITTING DIODE REFLECTORS

摘要

A resin composition useful in the production of light-emitting diode reflectors is provided, which can suppress delamination or bubbling in epoxy bonding or epoxy sealing even when preliminary drying such as heating is not carried out. The resin composition is characterized by comprising 100 parts by weight of a polyamide resin and 1 to 200 parts by weight of an inorganic filler (B), the polyamide resin being one comprising diamine units consisting of 50 to 100 mole % of 1,9-diaminononane and 0 to 50 mole % of a linear aliphatic diamine having 6 to 12 carbon atoms and/or an aliphatic diamine having a C6-12 side chain and dicarboxylic acid units consisting of 60 to 100 mole % of terephthalic acid and 0 to 40 mole % of an aromatic dicarboxylic acid except terephthalic acid and/or an aliphatic dicarboxylic acid having 4 to 20 carbon atoms.