发明名称 |
Semiconductor device and method for the fabrication thereof |
摘要 |
Disclosed is a semiconductor device <bold>10 </highlight>comprising a first semiconductor element <bold>11 </highlight>with an arrangement of first element electrodes <bold>12</highlight>, a second semiconductor element <bold>13 </highlight>with an arrangement of second element electrodes <bold>14</highlight>, a connection member <bold>15 </highlight>electrically connecting together a portion <bold>12</highlight><italic>b </highlight>of the first element electrodes <bold>12 </highlight>and the second element electrodes <bold>14</highlight>, an insulation layer <bold>17 </highlight>covering a major surface <bold>11</highlight><italic>a </highlight>of the first semiconductor element <bold>11 </highlight>and a backside surface <bold>13</highlight><italic>b </highlight>of the second semiconductor element <bold>13</highlight>, a wiring layer <bold>22 </highlight>formed on the insulation layer <bold>17 </highlight>and electrically connected to the first element electrode portion <bold>12</highlight><italic>b </highlight>exposed in an opening portion <bold>21</highlight>, and an external electrode <bold>23 </highlight>formed, as a portion of the wiring layer <bold>22</highlight>, on the insulation layer <bold>17. </highlight>
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申请公布号 |
US2003194834(A1) |
申请公布日期 |
2003.10.16 |
申请号 |
US20030387457 |
申请日期 |
2003.03.14 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
WATASE KAZUMI;FUJIMOTO HIROAKI;SAHARA RYUICHI;SHIMOISHIZAKA NOZOMI;KUMAKAWA TAKAHIRO;KAINO KAZUYUKI;NAKAMURA YOSHIFUMI |
分类号 |
H01L25/18;H01L23/31;H01L23/48;H01L23/498;H01L25/065;H01L25/07;(IPC1-7):H01L21/48;H01L21/50;H01L21/44 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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