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发明名称
IN PACKAGE POWER SUPPLIES FOR INTEGRATED CIRCUITS
摘要
<p>A device (14) in an integrated circuit with an on chip power supply (16) may be utilized to supply power to other components (20). As a result, the overall system (10) size may be reduced and economies may be achieved.</p>
申请公布号
WO2003085725(P1)
申请公布日期
2003.10.16
申请号
US2003009017
申请日期
2003.03.26
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发明人
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