发明名称 |
Method for manufacturing semiconductor device |
摘要 |
A method for manufacturing a semiconductor device including a non-volatile memory device and a resistance element including a resistance conductive layer is provided. The method comprises the following steps: a step of pattering a stopper layer and a first conductive layer to form a gate layer; a step of patterning the stopper layer, a dielectric layer and the first conductive layer to form a resistance conductive layer; a step of forming sidewall-like control gates on both side surfaces of the gate layer through ONO films at least within a memory region; a step of forming a second conductive layer above the gate layer and the resistance conductive layer; a step of forming a word line by patterning the second conductive layer; and a step of forming a word gate by patterning the gate layer.
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申请公布号 |
US2003194841(A1) |
申请公布日期 |
2003.10.16 |
申请号 |
US20030379387 |
申请日期 |
2003.03.04 |
申请人 |
INOUE SUSUMU;EBINA AKIHIKO |
发明人 |
INOUE SUSUMU;EBINA AKIHIKO |
分类号 |
H01L21/8247;H01L21/28;H01L21/822;H01L21/8246;H01L27/04;H01L27/10;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L21/336 |
主分类号 |
H01L21/8247 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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