发明名称 Method for manufacturing semiconductor device
摘要 A method for manufacturing a semiconductor device including a non-volatile memory device and a resistance element including a resistance conductive layer is provided. The method comprises the following steps: a step of pattering a stopper layer and a first conductive layer to form a gate layer; a step of patterning the stopper layer, a dielectric layer and the first conductive layer to form a resistance conductive layer; a step of forming sidewall-like control gates on both side surfaces of the gate layer through ONO films at least within a memory region; a step of forming a second conductive layer above the gate layer and the resistance conductive layer; a step of forming a word line by patterning the second conductive layer; and a step of forming a word gate by patterning the gate layer.
申请公布号 US2003194841(A1) 申请公布日期 2003.10.16
申请号 US20030379387 申请日期 2003.03.04
申请人 INOUE SUSUMU;EBINA AKIHIKO 发明人 INOUE SUSUMU;EBINA AKIHIKO
分类号 H01L21/8247;H01L21/28;H01L21/822;H01L21/8246;H01L27/04;H01L27/10;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L21/336 主分类号 H01L21/8247
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