Method of laser machining materials with minimal thermal loading

摘要

A method of controlling thermal loading of an electronic component material during ablation thereof provides a first laser light beam 42 at a certain power density and fluence and uses the first laser light beam to remove a portion of a first side 47 of the material 36. A second laser light beam 44 is provided at a certain power density and fluence and the second laser light beam is used to remove a portion of a side 49 of the material opposing the first side thereof substantially simultaneously as the portion of the first side is being removed.