发明名称 |
METHODS FOR HERMETICALLY SEALING MICROCHIP RESERVOIR DEVICES |
摘要 |
Methods are provided for hermetically sealing the reservoirs of microchip devices and for hermetically sealing the substrate assemblies in a hermetic packaging structure. In one embodiment, the method comprises (1) providing a primary substrate having a front side and a back side, the substrate comprising a plurality of reservoirs positioned between the front side and the back side, each reservoir being loaded with molecules or a secondary device for controlled release or exposure, the reservoirs having at least one opening in need of sealing, the primary substrate including one or more hermetic sealing materials; (2) providing a hermetic sealing substrate having a surface composed of one or more hermetic sealing materials; (3) positioning the hermetic sealing substrate over the reservoir openings and contacting said hermetic sealing materials of the primary substrate with said hermetic sealing materials of the hermetic sealing substrate; and (4) applying energy or a mechanical force to the contacted sealing materials effective to form a hermetic seal between the hermetic sealing substrate and the primary substrate to hermetically seal the reservoir openings. |
申请公布号 |
WO03032957(A3) |
申请公布日期 |
2003.10.16 |
申请号 |
WO2002US20490 |
申请日期 |
2002.06.28 |
申请人 |
MICROCHIPS, INC. |
发明人 |
UHLAND, SCOTT, A.;POLITO, BENJAMIN, F.;HERMAN, STEPHEN, J.;SANTINI, JOHN, T., JR. |
分类号 |
B81C3/00;A61K9/00;A61K9/22;B23K1/06;B23K26/00;B81B1/00;H01L27/14 |
主分类号 |
B81C3/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|