| 摘要 |
A method for manufacturing contact plug is disclosed. A dielectric layer is formed over a substrate having a conductive region. A contact opening is formed in the dielectric layer and exposing the conductive region within the opening. A first refractory metal layer is formed over the dielectric layer, and the sidewalls and bottom of the contact opening. A first refractory metal nitride layer is formed on the first refractory metal layer. A first plasma treatment step is carried out to transform the first refractory metal nitride layer into a first metal nitrided barrier layer. A thermal-process is carried out to form metal silicide on the conductive region. A second refractory metal nitride layer is formed on the first metal nitride barrier layer. A second plasma treatment step is carried out to transform the second refractory metal nitride layer into a second metal nitrided barrier layer. A conductive metal layer is deposited over the resulting structure and then the top surface is planarized to remove portions of the conductive metal layer, the second metal nitride barrier layer, the first metal nitride barrier layer, and the first refractory metal layer until the dielectric layer is exposed.
|
