发明名称 |
Apparatus and method for protecting an electronic circuit |
摘要 |
The present invention provides in one embodiment, a system for encapsulating a substrate on a vehicle structure. The system includes the substrate, the vehicle structure and a package substrate. The substrate has a top portion and a bottom portion. The vehicle structure is operatively connected to the bottom portion of the substrate. The package substrate has a plurality of layers, where the package substrate is operatively connected to the top portion of the substrate. The package substrate conforms to a periphery area of the top portion of the substrate.
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申请公布号 |
US2003193113(A1) |
申请公布日期 |
2003.10.16 |
申请号 |
US20020123793 |
申请日期 |
2002.04.15 |
申请人 |
VISTEON GLOBAL TECHNOLOGIES, INC. |
发明人 |
GLOVATSKY ANDREW |
分类号 |
B29C70/72;H05K3/28;(IPC1-7):B29C70/72;B29C70/88 |
主分类号 |
B29C70/72 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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