发明名称 |
Methods for making semiconductor packages with leadframe grid arrays |
摘要 |
Methods of forming a semiconductor assembly includes a leadframe with leads having offset portions exposed at an outer surface of a material package to form a grid array. An electrically conductive compound, such as solder, may be disposed or formed on the exposed lead portions to form a grid array such as a ball grid array ("BGA") or other similar array-type structure of dielectric conductive elements. The leads may have inner bond ends including a contact pad thermocompressively bonded to a bond pad of the semiconductor chip to enable electrical communication therewith and a lead section with increased flexibility to improve the thermocompressive bond. The inner bond ends may also be wirebonded to the bond pads.
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申请公布号 |
US2003194837(A1) |
申请公布日期 |
2003.10.16 |
申请号 |
US20030422250 |
申请日期 |
2003.04.24 |
申请人 |
YU CHAN MIN;LENG SER BOK;WAF LOW SIU;POO CHIA YONG;KOON ENG MEOW |
发明人 |
YU CHAN MIN;LENG SER BOK;WAF LOW SIU;POO CHIA YONG;KOON ENG MEOW |
分类号 |
H01L21/56;H01L21/60;H01L23/31;H01L23/48;H01L23/495;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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