发明名称 |
Method for fabricting a resistor on a printed circuit board |
摘要 |
A method for fabricating a resistor on a printed circuit board (PCB) uses a resistance film material and a dry etching process to form a resistor on the PCB. The resistance film material has low dissolvent content to prevent the resistor from shrinking and affecting the resistance of the resistor. The resistance film material has a fixed thickness, so the thickness of the resistor in the PCB is easily controlled. Furthermore, the method uses a dry etching process to precisely form the resistor on the PCB to make the length and width of the resistor pattern very accurate.
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申请公布号 |
US2003194845(A1) |
申请公布日期 |
2003.10.16 |
申请号 |
US20020119214 |
申请日期 |
2002.04.10 |
申请人 |
COMPEQ MANUFACTURING COMPANY LIMITED |
发明人 |
JONG WEN-LONG |
分类号 |
H01C17/24;H01C17/242;H05K1/09;H05K1/16;H05K3/02;(IPC1-7):H01L21/822 |
主分类号 |
H01C17/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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