发明名称 Film bulk acoustic resonator and method of forming the same
摘要 A film bulk acoustic resonator (FBAR) includes an insulation layer on a substrate to prevent a signal from being transmitted to a substrate. The FBAR includes a portion of a membrane layer corresponding to an activation area to adjust a resonance frequency band and improve a transmission gain of the resonance frequency band, the portion of the membrane layer being partially etched to have a thickness less than the other portion of the membrane layer. A method of forming the FBAR includes forming an sacrificing layer made of polysilicon, forming an air gap using a dry etching process, and forming a via hole. The method prevents structural problems occurred in a conventional air gap forming process and provides locations and the number of the via holes to be controlled.
申请公布号 US2003193269(A1) 申请公布日期 2003.10.16
申请号 US20020320361 申请日期 2002.12.17
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 JANG JAE WOOK;SUNWOO KUK HYUN
分类号 H01L41/09;H01L41/08;H01L41/187;H01L41/22;H03H3/02;H03H3/04;H03H9/15;H03H9/17;(IPC1-7):H01L41/08 主分类号 H01L41/09
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