Making solder joints, especially for spot soldering on thin film products, involves storing quantity of heat in entirety, transferring stored quantity of heat to soldering position without re-heating

摘要

The method involves transferring a defined quantity of heat to the soldering point by first storing the heat quantity in its entirety and finally transferring the stored quantity of heat to the soldering position without re-heating. The temperature of the storage medium or soldering position is measured and, if below the solder solidification point, further heat transfer is interrupted and a quantity of heat is stored for the next soldering cycle. AN Independent claim is also included for the following: an arrangement for implementing the inventive method.