发明名称 METHOD OF MOUNTING AN ELECTRONIC DEVICE ON A SUBSTRATE BY A LASER BEAM
摘要 A metod of surface mounting an electrical component (2) on a substate (10), in which a contact area (8) of the component (2) is electrically connected to a conductive area (14) on the substrate, the metod comprising the steps of: positioning the component against the substrate in the position for mounting; and directing a laser beam through the substrate towards the contact area of the component such that the conductive area on the substrate facing the contact area absorbs energy fron the laser beam and is thereby bonded to the contact conductive area, the substrate being arranged to be transmissive to the light and wherein the substrate is a plastics or polyester material.
申请公布号 WO03030248(A3) 申请公布日期 2003.10.16
申请号 WO2002GB04397 申请日期 2002.09.30
申请人 POLY-FLEX CIRCUITS LIMITED;KIRBY, NEIL;JEFFERIES, JOHN 发明人 KIRBY, NEIL;JEFFERIES, JOHN
分类号 B23K26/18;H01L21/60;H01L23/13;H01L23/14;H01R43/02;H05K1/09;H05K3/32 主分类号 B23K26/18
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